Kinetics of Static Grain Growth in Dynamically Recrystallized Copper Polycrystals with Different Purities
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The Effect of Target Purities on Grain Growth in Sputtered Copper Thin Films
Grain growth rates in sputtered Cu thin films were found to be influenced by impurity levels of the sputtering targets. The Cu thin films with thickness of 100 nm or 1mm were deposited on the rigid substrates by a sputter-deposition technique using the Cu target with purity of 99.99% (4N) or 99.9999% (6N), then subsequently annealed at room temperatures. The microstructures of the Cu films were...
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ژورنال
عنوان ژورنال: Materials Transactions, JIM
سال: 1996
ISSN: 0916-1821,2432-471X
DOI: 10.2320/matertrans1989.37.1422